Assembly technologies

• High performance SMT fully automatic lines incl. N₂ reflow ovens
• In-line laser marking for substrates serialization
• In line dispensing module for glue and solder paste
• In-line SPI for solder paste inspection
• In-line AOI of soldered components
• Stencil automatic cleaning
• Laminar and Selective wave soldering (inert gas atmosphere)
• Soldering robots

Dispensing and protection

• Fully automatic conformal coating line
• Automatic dispensing modules for glue and solder past
• Automatic dispensing of bi-components resins
• 3 and 4 axis encapsulating robots

Test and control technologies

Development of procedures and equipment for PCBA testing in according with customer specification.

• In-circuit Flying Probe
• In-circuit Bed of Nails
• Functional test
• High- Voltage insulation
• Functional power test on devices and boards
• Thermal cycles shocks
• Burn-in
• Off-line X-Ray inspection

Bonding and packaging

• High Speed Automatic Gold Wire Thermosonic Ball Bonding
• Destructive/non destructive Mechanical Testing; Pull/Shear Tests
• Bare dice glop top encapsulation
• Fine and gross leak hermeticity test [MIL-STD]